High-frequency communication for civil use has been greatly developed. It plays an important role in various fields such as long-distance high communication, navigation, medical treatment, transportation, transportation, warehousing, etc. At the same time, it has high confidentiality and high transmission quality, which makes mobile phones, car phones and wireless communication develop to high frequency. The frequency of use is transferred from MHz to GHz band, and information transmission enters the high frequency field.
The high frequency and high speed of electronic information products put forward higher requirements for the high frequency characteristics of copper clad plates, that is, the base materials with low dielectric constant and low dielectric loss factor.

How to choose the right product depends on your application. We always suggest you contact us to discuss your needs

Product
• Low dielectric constant high temperature resistant phosphorus flame retardant JH-100
JH-100 is a high melting point, high temperature and halogen-free phosphorus flame retardant with low dielectric constant and high thermal stability (TGA 5%, >370C). It can be used as a unique flame retardant in some specific fields, such as thermoplastic resins which require strict processing conditions. It is characterized by the high phase transition temperature (DSC, 295C), which makes the resin have better thermal properties when applied to it.

In addition, when JH-100 is added to the formula, excellent electrical properties (Dk/Df) can be maintained, compared with common phosphorus-based flame retardants. Therefore, it is especially suitable for high frequency transmission and low loss electrical components.

JH 100 is particularly recommended for styrene plastics, halogen-free lead-free high-performance copper foil multilayers, and thermoplastic resins, such as epoxy and nylon resins, which require a very high processing temperature.


• Bihydroxy-terminated polyphenyl ether oligomer JH-200

JH-200 structural formula

JH-200 is a dihydroxy-terminated polyphenyl ether oligomer with high reactivity and is well suited to react with epoxy resins, cyanate esters and polyurethane thermosetting materials. It has excellent solubility and low viscosity in toluene and methylacetone. Reacting with epoxy resin and applied to electronic packaging materials, including copper clad sheets, semi-cured sheets, protective coatings and various composite materials, can significantly improve various properties (such as heat resistance, dielectric properties, mechanical properties, flame retardance, moisture absorption).

• Bifunctional acrylic terminated polyphenyl ether oligomer JH-300

JH-300 structural formula

JH-300 is a difunctional acrylic acid-terminated polyphenyl ether oligomer which is well suited for free radical polymerization with other unsaturated monomers or resins, including styrene, allyl, acrylic acid, maleimide, methacrylic acid and unsaturated polyester monomers and resins. It also has excellent solubility and low viscosity in toluene and butanone. Mainly used in electronic packaging materials, including PCB substrates, copper clad plates, non-epoxy semi-cured sheets and adhesives, this product is designed for ultra-low dielectric and low water absorption applications.

JH-300 resin can be used in copper clad sheets and semi-cured sheets for high-speed circuits. The functionalized acrylic end groups ensure that PPO reacts efficiently with crosslinking agents. It can also be used in other composite materials such as hydrocarbon resins: styrene butadiene block copolymer, styrene-isoprene block copolymer, 1,2-polybutadiene, 1,4-polybutadiene, maleic acid modified polybutadiene, acrylic acid modified polybutadiene, epoxy modified polybutadiene.

• Liquid polybutadiene JB-9030

JB-9030 is a 1,2-polybutadiene dilute homopolymer, which has excellent plasticity as modifier for various plastic resins and compositions. JB-9030 has a 1,2-vinyl structure of more than 90% with a molecular weight of about 3000 and is highly responsive to heat or light stimulation. In addition, its characteristic structure gives it low dielectric constant characteristics, making it an ideal electrical or electronic material.
Application: Resin modifiers, plasticizers, additives, photomechanical materials, adhesives, water-based coatings, electrodeposited coatings, electrical insulation materials, sintering binders